| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board, in which the circuit board having a fine conductive pattern having a smooth and consecutive shape can be manufactured. <P>SOLUTION: A method for manufacturing a circuit board 10 including a base material 1, an underlayer 2, and a circuit pattern 3, comprises the steps of: forming the underlayer 2 on a surface of the base material 1 using a polymer; forming droplets 4 on a surface of the underlayer 2 by dripping a conductive ink containing conductive particles and a solvent using an ink jet printing method; combining the droplets 4 with each other to form united bodies 7 by increasing a contact area of the droplets 4 with respect to the surface of the underlayer 2; and heat-treating the united bodies 7 to form the circuit pattern 3. In the method, the polymer is a temperature responsive polymer that changes a wettability of the surface of the underlayer 2 with respect to the droplets 4 by temperature, and the underlayer 2 is preliminarily heated to a temperature indicating liquid repellency against the conductive ink before the conductive ink is dripped on the underlayer 2, and the increased contact area of the droplets 4 with respect to the surface of the underlayer 2 changes the temperature of the underlayer 2, thereby increasing the wettability of the surface of the underlayer 2 with respect to the droplets 4. <P>COPYRIGHT: (C)2012,JPO&INPIT |
