| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat dissipation structure, namely a heat dissipation unit, with a reduced weight. <P>SOLUTION: A heat dissipation unit comprises: a partition plate 9 which divides the inside of an electronic device from the outside; a heat exchanger 10 arranged in the electronic device outer side of the partition plate 9; and a rear cover 8 covering the electronic device outer side of the heat exchanger 10. The partition plate 9 has an upper vent hole 12 and a lower vent hole 13. The heat exchanger 10 is composed of a plurality of warm air paths 14 which connect, in the electronic device outer side of the partition plate 9, the upper vent hole 12 and the lower vent hole 13. In the electronic device outer side of the partition plate 9, a blower 11 is arranged to blow air in the electronic device inner side of the partition plate 9 from the upper vent hole 12 to the lower vent hole 13 via the warm air paths 14. A vent hole 8a is arranged in an area between the adjacent warm air paths 14 on the rear cover 8. The vent hole 8a is provided with a bent piece 8b which is bent toward the area between the adjacent warm air paths 14. <P>COPYRIGHT: (C)2012,JPO&INPIT |
