| 摘要 |
<p>The purpose of the present invention is to provide an electroless gold plating solution which can achieve the direct gold plating treatment on a film to be plated of a base metal such as nickel and palladium, can form a gold-plated coating film having a thickness of 0.1 µm or more and can form a uniform gold-plated coating film, and for which the plating operation can be carried out safely. The present invention relates to an electroless gold plating solution characterized by comprising a water-soluble gold compound and either of hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetratemine. Hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine is preferably contained in an amount of 0.1-100 g/L.</p> |
