发明名称 |
MODULE AND PORTABLE TERMINAL |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a module and a portable terminal capable of shielding an electronic component sealed by a mold resin and coated by a shield conductor film per circuit block. <P>SOLUTION: A shield conductor wall is formed between circuit blocks by mounting a plurality of conductor components 16 on a top face of a circuit board 10. Each of the conductor components 16 is electrically connected to a solid ground 19 in an inner layer of the circuit board 10 via a ground pad 17 and a via through hole 18 formed on the circuit board 10. The conductor components 16 can also be made conductive with a shield conductor film 21 by exposing them from a top surface of a mold resin 20 and coating their surfaces with the shield conductor film 21. This enables the conductor components 16 to electromagnetically shield the portion between the circuit blocks, thereby preventing a crosstalk between the circuit blocks and characteristic deterioration caused by EMC radiation noise. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012019091(A) |
申请公布日期 |
2012.01.26 |
申请号 |
JP20100155903 |
申请日期 |
2010.07.08 |
申请人 |
SONY CORP |
发明人 |
TSUKAMOTO SOTARO;INAGAKI EIGO |
分类号 |
H01L23/00;H01L23/28;H01L25/04;H01L25/18;H05K3/28;H05K9/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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