| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for and the manufacturing method of a solid-state imaging device having a bonding surface without an interspace. <P>SOLUTION: The solid-state imaging device manufacturing method comprises the steps of preparing a first substrate with a principal surface on which a photoelectric conversion element is disposed and a first wiring structure, preparing a second substrate with a principal surface on which a part of peripheral circuits are disposed and a second wiring structure, and bonding the first substrate, the first wiring structure, the second wiring structure and the second substrate so as to be disposed in this order. A recess is disposed at least one of an top face of the first wiring structure and a top face of the second wiring structure, and a conductor is disposed at the bottom face of the recess. <P>COPYRIGHT: (C)2012,JPO&INPIT |
