| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser beam machining system and a laser beam machining method which can attain concurrently the improvement of divisibility of an optical device wafer, and the suppression of degradation of electrical property of a light emitting device. <P>SOLUTION: A laser beam machining unit 26 includes a light condenser 44 which separates a laser beam oscillated by an oscillator 41 into a separated light 47a of which the polarization direction intersects perpendicularly with the progressing direction of machining and a separated light 47b of which the polarization direction is in parallel to the progressing direction of machining, and gets them displaced in the thickness direction of a wafer W to condense the lights at two condensing points. At this time, the separated light 47a is condensed in a condensing point 48a far from a surface Wb of the wafer W in which the light emitting device is formed, the separated light 47b is condensed in a condensing point 48b near the surface Wb of the wafer W. <P>COPYRIGHT: (C)2012,JPO&INPIT |
