| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid discharge head for achieving excellent bonding of wiring substrates and a supporting member, enabling highly reliably wire bonding of element substrates and the wiring substrates, while suppressing an increase in the distance between the liquid discharge head and paper. <P>SOLUTION: The liquid discharge head includes: the element substrate including an energy generating element; a supporting member supporting the element substrate; a sheet member provided on the supporting member; and the wiring substrate provided on the sheet member and including a wire electrically connected to the energy generating element, wherein the height of a wiring substrate surface opposite to that contacting the sheet member from supporting member is lower than the height of an element substrate surface opposite to that contacting the supporting member from the supporting member. <P>COPYRIGHT: (C)2012,JPO&INPIT |
