| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a grinding device which grinds a workpiece such as a semiconductor wafer, and can suppress a sideslip of the workpiece. <P>SOLUTION: A plurality of circular hole parts 124 are formed, with a suction port 121 as a point symmetric site, in a region of the support member 120 on which the workpiece W is mounted. With such a structure of the support member 120, the plurality of hole parts 124 formed on the support member 120 releases air interposed between an upper surface of the support member 120 and a lower surface of the workpiece W to a lower surface side of the support member 120. Therefore, when the workpiece W is dropped from a few mm above the upper surface of the support member 120 to mount the workpiece W on the upper surface of the support member 120, cases where the workpiece significantly sideslips on the upper surface of the support member 120 and the workpiece W is not adequately supported can be suppressed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
