发明名称 HEAT-PUMP HEAT SOURCE DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat-pump heat source device that has a superior blowing performance. <P>SOLUTION: The device includes: a bottom plate 1; a heat exchanger 3 arranged on the bottom plate 1; an evaporator 2; a heat insulator 4 covering the heat exchanger 3; and a blower 6 for blowing air to the evaporator 2. The evaporator 2 is arranged on the bottom plate 1 so that a lower end thereof is below an upper end of the heat insulator 4. The blower 6 is arranged substantially above the heat insulator 4 to form a blower circuit. An opening area of the blower circuit for guiding air to the evaporator 2 is larger than when a protective cover is used, to reduce overall stack loss of the blower circuit. In addition, the blower can be configured so that a front area of the evaporator 2 is substantially equal to the conventional one having the protective cover. A shortest distance between the evaporator 2 and the heat insulator 4 below the evaporator 2 is larger than a distance between the evaporator 2 and the protective cover in the conventional one having the protective cover, thereby reducing local stack loss, while improving blowing performance. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012017915(A) 申请公布日期 2012.01.26
申请号 JP20100155657 申请日期 2010.07.08
申请人 PANASONIC CORP 发明人 YAMAOKA YOSHIKI;TACHIMORI MAKOTO;NAKATANI KAZUTO
分类号 F24H9/00;F25B39/04 主分类号 F24H9/00
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