| 摘要 |
An electronic component assembly is provided having an integrated circuit supported on a first mounting area such that a first surface of the integrated circuit contacts the first mounting area, electrical conductors supported on a second mounting area, and a series of wire bonds extending from contact pads on a second surface of the integrated circuit, opposite the first surface, to the electrical conductors. The first and second mounting areas are stepped relative to one another and the wire bonds are covered in a bead of encapsulant. The bead of encapsulant has a profiled surface that is flat and inclined relative to the second surface. |
