| 发明名称 |
WIRING BOARD AND MANUFACTURING METHOD THEREOF |
| 摘要 |
<p>A wiring board and a manufacturing method thereof are provided. The wiring board includes: an outer wiring layer, a wiring layer, a body layer, a high density interconnection board (HDI board), and at least a first conductive plug. The body layer is mounted between the outer wiring layer and the wiring layer, and the HDI board is buried in the body layer. The first conductive plug is formed in the body layer, and connects the HDI board to the outer wiring board.</p> |
| 申请公布号 |
WO2012009831(A1) |
申请公布日期 |
2012.01.26 |
| 申请号 |
WO2010CN01116 |
申请日期 |
2010.07.23 |
| 申请人 |
UNIMICRON TECHNOLOGY CORP.;CHANG, CHEN-CHUAN;HUANG, HAN-PEI;CHANG, CHIN-CHUNG |
发明人 |
CHANG, CHEN-CHUAN;HUANG, HAN-PEI;CHANG, CHIN-CHUNG |
| 分类号 |
H05K1/02;H01L21/48;H01L23/48;H05K3/46 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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