发明名称 CAMERA MODULE
摘要 PURPOSE: A camera module is provided to surround a flexible printed circuit board by a printed circuit board, thereby increasing RF receiving sensitivity. CONSTITUTION: An image sensor(200) converts an optical signal into an electrical signal. A lens unit(100) irradiates light to the image sensor. A first printed circuit board(310) includes the image sensor and the lens unit. A second printed circuit board(320) is separated from the first printed circuit board. A flexible printed circuit board(400) is inserted between the first printed circuit board and the second printed circuit board.
申请公布号 KR20120007728(A) 申请公布日期 2012.01.25
申请号 KR20100068405 申请日期 2010.07.15
申请人 LG INNOTEK CO., LTD. 发明人 PARK, JAE KEUN
分类号 H04N5/225 主分类号 H04N5/225
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