LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR ENCAPSULATING IT

摘要

PURPOSE: An LED package structure and a packaging method thereof are provided to normally operate a glass package layer under high temperature by sealing an LED chip with a glass material. CONSTITUTION: A metal thin film includes a first surface and a second back side which face and a first metal layer and a second metal layer which are insulated. An LED chip(120) includes a first electrode and a second electrode(122) and is arranged on the first surface of the metal thin film. The first electrode is electrically connected to the first metal layer. A second electrode is electrically connected to the second metal layer. A glass package(130) seals the LED chip and seals the second surface of the metal thin film not to be exposed.