PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to arrange an outer layer between an interfacial surface and a buried surface of an inner layer, thereby easily manufacturing a four-layer circuit board of a thin plate. CONSTITUTION: A first circuit pattern(109-112) is buried in an insulating layer(201). A first solder resist layer(203a,203b) is arranged on the insulating layer in which the first circuit pattern is buried. A second circuit pattern(214a-216a) is arranged in the upper part of one or more components among the first circuit pattern, the first solder resist layer, and the insulating layer. A second solder resist layer(217a,217b) is arranged on the first solder resist layer. The second solder resist layer includes an opening part which exposes a connection terminal to the outside. A surface processing layer(218a,218b) is arranged on the connection terminal which is exposed by the opening part.