发明名称 INCLUSION COMPLEX, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR
摘要 <p>It is an object of the present invention to provide a clathrate that suppresses a curing reaction at low temperature to promote an improvement in storage stability (one-component stability), and can effectively cure a resin by heating treatment. A clathrate suitable for the clathrate is a clathrate containing (b1) at least one selected from the group consisting of an aliphatic polyvalent carboxylic acid, 5-nitroisophthalic acid, 5-tert-butylisophthalic acid, 5-hydroxyisophthalic acid, isophthalic acid, and benzophenone-4,4'-dicarboxylic acid; and (b2) at least one selected from the group consisting of an imidazole compound represented by the following formula (I), and 1,8-diazabicyclo[5.4.0]undecene-7, at a molar ratio of 1:1.</p>
申请公布号 EP2410001(A1) 申请公布日期 2012.01.25
申请号 EP20100753277 申请日期 2010.03.15
申请人 NIPPON SODA CO., LTD. 发明人 KANEKO, MASAMI;ONO, KAZUO
分类号 C08G59/40;C07D487/04;H01L23/29;H01L23/31 主分类号 C08G59/40
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