| 摘要 |
<p>Polyamide molding composition comprises: 62-87 wt.% of a partially aromatic, partially crystalline copolyamide having a melting point of 270-320[deg] C and made up of 100 wt.% of diacid fraction composed of 50-100 wt.% of a diacid comprising terephthalic acid naphthalenedicarboxylic acid, and its mixtures, 0-50 wt.% of isophthalic acid and 100 wt.% of diamine fraction composed of at least one diamine e.g. comprising butanediamine, pentanediamine and hexanediamine; (B) 5-15 wt.% of ionomer; (C) 8-18 wt.% of flame retardants; and (D) 0-5 wt.% of additives. Polyamide molding composition comprises: (A) 62-87 wt.% of a partially aromatic, partially crystalline copolyamide having a melting point of 270-320[deg] C and made up of 100 wt.% of diacid fraction composed of 50-100 wt.% of a diacid comprising terephthalic acid naphthalenedicarboxylic acid, and its mixtures, 0-50 wt.% of isophthalic acid and 100 wt.% of diamine fraction composed of at least one diamine comprising butanediamine, pentanediamine, hexanediamine, octanediamine, methyloctanediamine, nonanediamine, decanediamine, undecanediamine and dodecanediamine; (B) 5-15 wt.% of ionomer; (C) 8-18 wt.% of flame retardants; and (D) 0-5 wt.% of additives, where the components (A)-(D) add up to 100 wt.%. An independent claim is included for a molding produced using the composition.</p> |
