| 摘要 |
PURPOSE: A semiconductor device is provided to prevent the generation of a resin particle by supporting each part of the rear side of a sealing body through a flat part having a wide area when cutting a suspending lead, thereby improving the quality of a product. CONSTITUTION: A semiconductor chip(2) comprises a surface, a rear side, and a plurality of electrodes which is formed on the surface(2b). A chip loading part(1b) comprises a chip supporting surface and a rear side which is opposite side with the chip supporting surface. A suspending lead(1e) comprises a surface and a rear side which is opposite side with the surface. The suspending lead supports the chip loading part. A plurality of leads is arranged in around the chip loading part. A plurality of wires respectively connects a plurality of electrodes and a plurality of leads. |
