PRINTED WIRING BOARD MANUFACTURING METHOD

摘要

PURPOSE: A printed substrate manufacturing method is provided to reduce the thickness of a substrate by performing a half etching process and a soft-etching process, thereby easily arranging a micro circuit. CONSTITUTION: A hole is formed in the surface of a substrate by drilling the substrate(S10). A soft etching process is performed on the drilled substrate(S20). A chemical copper plating process is performed on the substrate in which the soft etching process is performed(S30). An electric copper plating process is performed on the substrate in which chemical copper is plated(S40). The soft etching process is performed on the substrate in which the electric copper plating process is performed in order to increase adhesion. A coating process and an exposure process for a dry film are performed on the substrate in which the soft etching process is to be performed(S60). A development process is performed on the substrate in which the exposure process is performed(S70). A half etching process is performed on the substrate in which the development process is performed(S80). The dry film is exfoliated on the substrate in which the half etching process is performed(S90). A circuit pattern is formed by performing the soft etching process on the substrate in which the dry film is exfoliated(S100).