发明名称 Laser processing method and laser processing apparatus
摘要 The present invention relates to a method and apparatus having a structure that enables laser processing of an object even when the object has a surface formed with irregularities. The laser processing method irradiates objects, each having a cylindrical form extending in a first direction, with laser light. Here, the objects are arranged on a first plane along a second direction orthogonal to the first direction. The arranged objects are irradiated with first and second laser light beams in irradiation directions different from each other to the first plane. At least during when the first and second irradiation light beams are respectively emitted, irradiation positions of the first and second laser light beams to the first plane are relatively moved.
申请公布号 US8101885(B2) 申请公布日期 2012.01.24
申请号 US20070878693 申请日期 2007.07.26
申请人 NAKAMAE KAZUO;KAKUI MOTOKI;TAMAOKI SHINOBU;SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 NAKAMAE KAZUO;KAKUI MOTOKI;TAMAOKI SHINOBU
分类号 B23K26/00 主分类号 B23K26/00
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