Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board

摘要

A photosensitive resin composition according to the invention comprises (A) a binder polymer, (B) a photopolymerizing compound with an ethylenic unsaturated group and (C) a photopolymerization initiator, wherein component (B) contains a compound represented by the following general formula (I). [Wherein R1-R3 each independently represent a group represented by the following general formula (II): or the following general formula (III): and at least one of R1-R3 is a group represented by general formula (III).]