发明名称 MIM capacitors in semiconductor components
摘要 Structures and methods of forming an ideal MIM capacitor are disclosed. The single capacitor includes a first and a second metal structure overlying a substrate, a first dielectric material disposed between a first portion of the first metal structure and a first portion of the second metal structure. A second dielectric material is disposed between a second portion of the first metal structure and a second portion of the second metal structure. No first dielectric material is disposed between the second portion of the first and second metal structures, and no second dielectric material is disposed between the first portion of the first and second metal structures. The first and second dielectric material layers include materials with opposite coefficient of capacitance.
申请公布号 US8101495(B2) 申请公布日期 2012.01.24
申请号 US20080048060 申请日期 2008.03.13
申请人 RIESS PHILIPP;FISCHER ARMIN;INFINEON TECHNOLOGIES AG 发明人 RIESS PHILIPP;FISCHER ARMIN
分类号 H01L21/8242 主分类号 H01L21/8242
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