发明名称 |
Method of fabricating printhead integrated circuit with backside electrical connections |
摘要 |
A method of fabricating a printhead integrated circuit configured for backside electrical connections. The method comprises the steps of: (a) providing a wafer comprising a plurality of partially-fabricated nozzle assemblies on a frontside of the wafer and through-silicon connectors extending from the frontside towards a backside of the wafer; (b) depositing a conductive layer on the frontside of said wafer and etching to form an actuator for each nozzle assembly and a frontside contact pad over a head of each through-silicon connector; (c) performing further MEMS processing steps to complete formation of nozzle assemblies ink supply channels through-silicon connectors; and (d) dividing the wafer into individual printhead integrated circuits. Each printhead integrated circuit thus formed is configured for backside-connection to the drive circuitry via the through-silicon connectors the contact pads. |
申请公布号 |
US8101438(B2) |
申请公布日期 |
2012.01.24 |
申请号 |
US20090509491 |
申请日期 |
2009.07.27 |
申请人 |
MCAVOY GREGORY JOHN;O'REILLY RONAN PADRAIG SEAN;JOHNSTONE DAVID MCLEOD;SILVERBROOK KIA;SILVERBROOK RESEARCH PTY LTD |
发明人 |
MCAVOY GREGORY JOHN;O'REILLY RONAN PADRAIG SEAN;JOHNSTONE DAVID MCLEOD;SILVERBROOK KIA |
分类号 |
H01L21/30 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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