| 摘要 |
A microphone module includes a cabinet, a sensor, an integrated circuit chip, a first substrate, and a second substrate. The first substrate carries the integrated circuit chip and includes a first top surface, a first bottom surface, and a first shielding part with a fixed electric potential extending from the first top surface to the first bottom surface. The second substrate includes a second top surface contacting the first bottom surface, a second bottom surface, and a second shielding part with the fixed electric potential on the second bottom surface, wherein the second shielding part is arranged in such a way that no electromagnetic waves can pass between the first shielding part and the second shielding part. |
