Imaging system and method with reduced thermal stress on a substrate

摘要

An imaging system including an image transfer structure configured to transfer marking material to a first side of a substrate; a tacker configured to fix the marking material to the substrate; a path controller; a substrate inverter; and a fuser. The path controller is configured to switch the substrate between a first path towards the fuser and a second path extending through the substrate inverter and returning to the image transfer structure.