发明名称 |
Photocurable and thermosetting resin composition, cured product thereof, and printed circuit board |
摘要 |
The present invention provides a photocurable and thermosetting resin composition having excellent surface curability and deep curability, allowing pattern formation with a laser beam having a wavelength of 350 to 410 nm, and being useful as a solder resist for laser direct imaging, the composition including a carboxylic resin (A), an oxime ester-based photopolymerization initiator (B) such as 2-(acetyloxyiminomethyl)thioxanthene-9-one, and another photopolymerization initiator than (B) such as 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, and a sulfur compound (E) such as 2-mercaptobenzothiazole.
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申请公布号 |
US8101336(B2) |
申请公布日期 |
2012.01.24 |
申请号 |
US20080195793 |
申请日期 |
2008.08.21 |
申请人 |
ITOH NOBUHITO;SHIBASAKI YOKO;KATO KENJI;ARIMA MASAO;TAIYO INK MFG. CO., LTD. |
发明人 |
ITOH NOBUHITO;SHIBASAKI YOKO;KATO KENJI;ARIMA MASAO |
分类号 |
G03F7/00;G03F7/004;G03F7/027;G03F7/028 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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