发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
Through heat discharge only by wiring connected to a conventional semiconductor chip, sufficient heat discharge performance may not be achieved in a recent semiconductor device. A semiconductor device according to an aspect of the present invention includes: a flexible substrate including a first main surface and a second main surface; a semiconductor chip; a first heat conductive layer formed on the first main surface of the flexible substrate and electrically connected to the semiconductor chip; and a second heat conductive layer formed on the second main surface of the flexible substrate and electrically insulated from the semiconductor chip.
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申请公布号 |
US8102046(B2) |
申请公布日期 |
2012.01.24 |
申请号 |
US20080285743 |
申请日期 |
2008.10.14 |
申请人 |
IWATA YASUAKI;SASAKI CHIHIRO;RENESAS ELECTRONICS CORPORATION |
发明人 |
IWATA YASUAKI;SASAKI CHIHIRO |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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