Camera module and imaging device

摘要

Provided are a camera module and electronic equipment that are advantageous in alleviating a stress to be imposed on connectors and a flexible substrate at the time of attaching a printed wiring substrate. A first flank 44 of a lens barrel 22 and a second flank 46 thereof intersect each other. An image sensor 26 is mounted with the back surface 26A thereof directed to a flexible substrate. A signal processing unit 30 is formed on a rigid printed wiring substrate 32. A flexible substrate 28 has a projecting portion 50 that projects from an intersectional part 48 at which the first flank 44 and second flank 46 intersect each other. The printed wiring substrate 32 is disposed on the second flank 46 via a temporary lock mechanism 54. The projecting portion 50 of the flexible substrate 28 is folded at the intersectional part 48, a flexible substrate-side connector 52 is coupled to a printed wiring substrate-side connector 56, and an adhesive layer 58 is bonded to the second flank 46. The flexible substrate 28 and printed wiring substrate 32 are thus mounted on the lens barrel 22.