发明名称 |
Via design for flux residue mitigation |
摘要 |
Provided is an electrically conductive via for reducing flux residue. The via has a first aperture having a first diameter size. The via further has a second aperture having a second diameter size. A chamber is disposed between the first aperture and the second aperture, the chamber having a third diameter size. At least one of the diameters being of a different dimension than the other two. In addition, the via may also provide improved test point access in addition to reducing flux residue. |
申请公布号 |
US8102057(B2) |
申请公布日期 |
2012.01.24 |
申请号 |
US20060645908 |
申请日期 |
2006.12.27 |
申请人 |
LEON ALEXANDER;REINOSA ROSA;CAROTHERS MICHAEL DAVID;GRIFFITHS GLEN;HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
LEON ALEXANDER;REINOSA ROSA;CAROTHERS MICHAEL DAVID;GRIFFITHS GLEN |
分类号 |
B32B3/24 |
主分类号 |
B32B3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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