发明名称 Coatings and hard mask compositions for integrated circuit applications methods of production and uses thereof
摘要 A coating material is described herein that includes at least one inorganic compound, and at least one densifying agent, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound. A method of producing a coating material is described herein that includes: providing at least one inorganic compound, providing at least one densifying agent, combining the at least one inorganic compound with the at least one densifying agent to form the coating material, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound.
申请公布号 US8101015(B2) 申请公布日期 2012.01.24
申请号 US20040570750 申请日期 2004.10.05
申请人 KENNEDY JOSEPH;HUANG WEI T.;DO KIM;STUCK JASON;LI BO;HONEYWELL INTERNATIONAL INC. 发明人 KENNEDY JOSEPH;HUANG WEI T.;DO KIM;STUCK JASON;LI BO
分类号 C09D183/08;C08K3/22;C08K5/02;C08K5/16 主分类号 C09D183/08
代理机构 代理人
主权项
地址