POSITIVE PHOTORESIST FOR COPPER BASED METAL FILM COMPOSITION AND PATTERNING METHOD OF PHOTORESIST USING THE SAME

摘要

PURPOSE: A positive photo-resist composition for a copper-based metal film and a method for forming a photo-resist pattern using the same are provided to prevent the collapse and the delamination of patterns in a developing process or an etching process. CONSTITUTION: A positive photo-resist composition includes 10-25 weight% of an alkali-soluble resin, 1-10 weight% of a photo-sensitive compound, 0.01-0.1 weight% of a compound represented by chemical formula 1, and remaining amount of a solvent based on the total weight of the composition. In the chemical formula 1, the R1 is hydrogen or hydroxyl group. The R2 and the R3 are respectively hydrogen, C1 to C5 alkyl group, or C6 to C15 aryl group. The alkali-soluble resin is a novolak resin.