发明名称 |
ANALYSIS METHOD FOR PLATING SOLUTION AND PLATING METHOD THEREBY |
摘要 |
PURPOSE: A method for analyzing plating solution and a plating method using the same are provided to analyze a polymeric material quantitatively and qualitatively by applying a mass analyzing technique and high-performance liquid chromatography. CONSTITUTION: A method for analyzing plating solution comprises next steps. Organic solvent is added to plating solution and they are mixed to melt a polymeric material in the plating solution with organic solvent. The melted organic solvent is separated from the polymeric material. The organic solvent is vaporized and the polymeric material is extracted. The extracted polymeric material is analyzed. The polymeric material is analyzed quantitively. The polymeric material is analyzed qualitatively. The extracted polymeric material is polymeric additive.
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申请公布号 |
KR20120006884(A) |
申请公布日期 |
2012.01.19 |
申请号 |
KR20100067597 |
申请日期 |
2010.07.13 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHO, DONG HYUN;LEE, HEE JIN;JEON, JI EUN |
分类号 |
C25D21/18;C25D21/14;G01N30/00 |
主分类号 |
C25D21/18 |
代理机构 |
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代理人 |
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地址 |
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