| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an interlayer adhesion sheet capable of low flow void-free molding without using an internal cushion, and to provide a multilayer flexible wiring board using it. <P>SOLUTION: In a method of manufacturing a multilayer flexible wiring board, interlayer adhesion sheets 1 each provided with an adhesive layer 3 on one side of a prepreg 2 are superimposed on both surfaces of a flexible inner layer circuit board in which a circuit is formed previously so that the adhesive layer 3 of the interlayer adhesion sheet 1 comes into contact with the circuit. Furthermore, a copper foil is superimposed on the outside of the interlayer adhesion sheet 1 and then molded integrally by hot press. <P>COPYRIGHT: (C)2012,JPO&INPIT |
