发明名称 |
HEAT-CONDUCTIVE SHEET |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-conductive sheet that has high thermal conductivity and thermal deformation resistance. <P>SOLUTION: The heat-conductive sheet is obtained by forming a heat-conductive resin composition comprising an ethylene-α-olefin-nonconjugated diene terpolymer and a thermally conductive filler into a sheet shape and irradiating the obtained formed sheet with an electron beam to crosslink the ethylene-α-olefin-nonconjugated diene terpolymer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012012424(A) |
申请公布日期 |
2012.01.19 |
申请号 |
JP20100147113 |
申请日期 |
2010.06.29 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
YAGI IZUMI;UEKI TAKAYUKI;KUROKI JUNICHI |
分类号 |
C08J5/18;C08K3/00;C08L23/08;H01L23/36;H01L23/373;H05K7/20 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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