THERMALLY SENSITIVE MATERIAL EMBEDDED IN THE SUBSTRATE
摘要
<p>A structure and methods for using an integrated circuit structure comprise a substrate (102) and circuitry (104) connected to the substrate. The substrate includes a heat sensitive material (106) that changes color when heated. The heat sensitive material (106) has one of a plurality of colors depending upon a temperature to which the substrate was exposed.</p>
申请公布号
WO2012009317(A1)
申请公布日期
2012.01.19
申请号
WO2011US43647
申请日期
2011.07.12
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION;AYOTTE, STEPHEN, P.;HOLVERSON, KRISTEN, L.;SULLIVAN, TIMOTHY, M.
发明人
AYOTTE, STEPHEN, P.;HOLVERSON, KRISTEN, L.;SULLIVAN, TIMOTHY, M.
