| 摘要 |
PURPOSE: Bonding composition of rotary target for sputtering and a method for conjugating the rotary target using the same are provided to lower a manufacturing cost and enable stable supply of materials. CONSTITUTION: Bonding composition(130) of rotary target for sputtering is as follows. A cylindrical target(120) is bonded to the outer circumferential surface of a backing plate(110). The backing plate is formed on the rotary target(100) applying high voltage. The backing plate is formed in a cylindrical shape. The bonding composition comprises tin of 90~96weight% and bismuth of 4~10weight%. One or more of a small amount of metallic elements of 1~40weight% selected from a group consisting of zinc, aluminum, copper, silver, germanium, gallium, antimony with respect to bismuth is further mixed.
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