发明名称 |
SEMICONDUCTOR LIGHT-EMITTING ELEMENT DEVICE, IMAGE EXPOSURE DEVICE, IMAGE FORMING DEVICE, AND IMAGE DISPLAY DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element device capable of easily and selectively etching wiring from a semiconductor thin film light-emitting element to a substrate or from the semiconductor thin film light-emitting element to a driving element on the substrate, an image exposure device including the semiconductor light-emitting element device, an electrophotographic image forming device including the image exposure device, and an image display device including the semiconductor light-emitting element device. <P>SOLUTION: A semiconductor light-emitting element device comprises: an integrated substrate 101 including electrode wiring 112 and 113; a semiconductor thin film light-emitting element 102 provided on the integrated substrate 101; electrode pads 108 and 109 that are provided on the semiconductor thin film light-emitting element 102 and are electrically connected to the semiconductor thin film light-emitting element 102; and removable connection wiring 111a and 111b electrically connecting the electrode pads 108 and 109 and the electrode wiring 112 and 113. The removable connection wiring 111a and 111b are composed of a material capable of selectively etching by chemical etching. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012015452(A) |
申请公布日期 |
2012.01.19 |
申请号 |
JP20100153100 |
申请日期 |
2010.07.05 |
申请人 |
OKI DATA CORP;OKI DIGITAL IMAGING CORP |
发明人 |
SUZUKI TAKAHITO;OGIWARA MITSUHIKO |
分类号 |
H01L33/38;B41J2/44;B41J2/45;B41J2/455;H01L33/40;H04N1/036 |
主分类号 |
H01L33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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