摘要 |
A MEMS device is disclosed comprising a cavity containing a MEMS component, the cavity being formed in a dielectric layer stack having a thickness td, whereby the cavity and the dielectric layer stack are sandwiched between a substrate and a sealing dielectric layer having a thickness ts, and whereby the MEMS component is enclosed by at least one trench extending over the thickness td of the dielectric layer stack and of the sealing dielectric ts.
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