发明名称 |
METHOD FOR FABRICATING AN INTERPOSER |
摘要 |
Method for fabricating an interposer is provided. A substrate is provided having thereon at least a conductive via and at least a flange. The flange is bonded on the substrate and shades a portion of the via. A photoresist layer is formed on the interior surface of the via, on a contact surface of the flange and on an inner surface of the flange opposite to the contact surface. An opening is formed in the photoresist layer to expose a portion of the contact surface of the flange, while the photoresist layer still covers the interior surface of the via and the inner surface of the flange. A plating layer is formed on the exposed contact surface of the flange. The photoresist layer is then removed. |
申请公布号 |
US2012015304(A1) |
申请公布日期 |
2012.01.19 |
申请号 |
US20100837462 |
申请日期 |
2010.07.15 |
申请人 |
LEE CHANG-MING;LIU WEN-FANG;HUANG SHIH-JUNG;SU LING-KAI |
发明人 |
LEE CHANG-MING;LIU WEN-FANG;HUANG SHIH-JUNG;SU LING-KAI |
分类号 |
G03F7/20;B05D5/12 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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