| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve downsizing, high integration, and low thermal resistance of a semiconductor package using a high heat-generating IC. <P>SOLUTION: A semiconductor device comprises: a member 1 with wiring; a lower chip 2b and an upper chip 2a that are mounted on the member 1 with wiring by wire-bonding connection; a heat sink 3 for effectively radiating heat from the chips to the external environment of a package; and a sealing resin 4 integrally sealing with the heat sink being exposed. Adhesive layers between the heat sink and the upper chip, between the semiconductor chips, and between the semiconductor chip and the member with wiring are formed by hardening a sheet adhesive. <P>COPYRIGHT: (C)2012,JPO&INPIT |
