| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board that can embody a high-power semiconductor package having electric reliability and safety, and to provide a method for manufacturing the same. <P>SOLUTION: A printed circuit board comprises: a base substrate 10 having a cavity formed therein; an anodically oxidized insulating layer 20 formed by anodizing the base substrate 10; and a circuit layer 52 formed in the cavity. A method for manufacturing the circuit board comprises the steps of: providing the base substrate 10; forming a cavity in the base substrate 10; anodizing the base substrate 10 in which the cavity is formed; and forming a circuit layer 52 in the cavity. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012015479(A) |
申请公布日期 |
2012.01.19 |
| 申请号 |
JP20100258977 |
申请日期 |
2010.11.19 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KANG JONG-UN;CHOI SYONG MUN;PARK JON-KYUN;LIM CHAN-HYUN;KIM KYAN-SOO |
| 分类号 |
H05K1/02;H01L23/12;H05K1/05;H05K3/44 |
主分类号 |
H05K1/02 |
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