| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for dividing an MEMS mirror from a substrate without damaging the MEMS mirror. <P>SOLUTION: The method includes: a reforming part forming step of intensively irradiating a support part 4b of a substrate 20 formed by supporting a mirror device body with the support part 4b, with a laser beam 74, to form a reforming part 75 in the support part 4b; and a dividing step of cutting the support part 4b by applying a force to the support part 4b so as to divide the mirror device body 2 from the substrate 20. A cross-sectional shape of the support part 4b is formed in a trapezoidal shape. In the reforming part forming step, the laser beam 74 is emitted from a longer one of the two parallel sides of the trapezoid. <P>COPYRIGHT: (C)2012,JPO&INPIT |
