| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a switching power supply module capable of facilitating miniaturization by increasing a packaging density and suppressing electromagnetic interference between packaged circuit components. <P>SOLUTION: A switching power supply module SMJ includes: a wiring substrate PCB having an interference prevention layer AIL that prevents interference between one face side and the other face side; a switching device IC packaged on one face side of the wiring substrate; and a thin inductor L packaged on the other face side of the wiring substrate to face the switching device. A metallic heat radiator AHR1 that comes into thermal contact with at least the switching device IC may be disposed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
