| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve cooling efficiency in an electronic device and a method for manufacturing the electronic device. <P>SOLUTION: The electronic device includes a base substrate 30 with multiple grooves 30b formed on its surface and an electronic component 40 having a main surface 40a connected with the surface of the base substrate 30 through a parylene thin film 33. A passage, in which cooling fluid C flows, is defined by the main surface 40a and the grooves 30b, and parylene exists on an inner surface of each groove 30b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
