| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor mounting device with a built-in patch antenna, which ensures high radiation efficiency by securing a thickness of a dielectric to allow near field connection and low parasitic inductance connection between the patch antenna and the semiconductor device. <P>SOLUTION: A semiconductor mounting device 1A (1) of the present invention comprises a semiconductor device 40 at least including an insulation substrate 10, a dielectric layer 11 disposed on one face side of the insulation substrate 10, first terminal parts 14a, 14b disposed on the dielectric layer 11 and a high-frequency semiconductor 30 mounted on the first terminal parts 14a, 14b via a bump 31, and an antenna part 21 forming a patch antenna 20. The antenna part 21 includes an antenna upper face part 22 provided on a printed board 50 disposed on another face side of the insulation substrate 10, the printed board 50 and a first ground pattern 51 disposed on a face of the printed board 50 opposite to the face on which the antenna upper face part 22 is disposed. The first terminal parts 14a, 14b and a second terminal part disposed on the printed board 50 are electrically connected. <P>COPYRIGHT: (C)2012,JPO&INPIT |
