| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing die bond film having a dicing film and a die bond film which (1) ensures good holding power for a semiconductor wafer when it is diced, and good detachability of a semiconductor chip from a substrate regardless of the size or the thickness of the semiconductor wafer or the semiconductor chip, (2) has little impact on the environment or human health, and (3) can be handled easily. <P>SOLUTION: A dicing die bond film 11 includes a dicing film having an adhesive layer 2 on a substrate 1, and a die bond film 3'. The adhesive layer contains a polymer (P) cured by UV-irradiation. The polymer (P) is obtained by a reaction of a polymer (A) composed of a constituent containing, as a main monomer, acrylic ester and a monomer containing a carboxyl group, and a compound (B) containing an oxazoline group which has an oxazoline group and a radical reactive carbon-carbon double bond. The die bond film contains epoxy resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
