| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board where a fine semiconductor element connection pad having, for example, 20 μm or less of width and interval, can be formed and an external connection pad is not peeled off even if a large stress is applied when the external connection pad is connected to an external electric circuit board. <P>SOLUTION: A wiring board comprises: a first wiring conductor 3 including a semiconductor element connection pad 5 deposited and formed on one main surface of an insulation board 1 by a semi-additive method; and a second wiring conductor 3 including an external connection pad 6 deposited and formed on the other main surface of the insulation board 1 by a semi-additive method. The first wiring conductor 3 consists of an electroless plating layer 3a deposited on an insulation layer 2 on one main surface and an electroplated layer 3b on the electroless plating layer 3a. The second wiring conductor 3 consists of metal foil 3c directly deposited on the insulation layer 2 on the other main surface, the electroless plating layer 3a and the electroplated layer 3b on the electroless plating layer 3c. <P>COPYRIGHT: (C)2012,JPO&INPIT |
