| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a coil device used for a high-frequency circuit and the like, the coil device being capable of improving a high-frequency performance without deteriorating an L value. <P>SOLUTION: A manufacturing method comprises: a first step of forming a first insulation layer; a second step of forming a first conductive wiring pattern on the first insulation layer; a third step of forming a second conductive wiring pattern that functions as a pad on the first conductive wiring pattern; a forth step of forming a second insulation layer made of a photosensitive material on the first insulation layer including the first and second conductive wiring patterns; and a fifth step of forming a via hole at a location corresponding to the pad on the second insulation layer by photolithography; and a sixth step of forming a third conductive wiring pattern on the second insulation layer and forming a via by filling a conductive material in the via hole. A laminate formed through these steps is peeled off from a substrate, cut, degreased, and baked, so that an external electrode is formed to obtain a chip-type coil device. <P>COPYRIGHT: (C)2012,JPO&INPIT |
