| 摘要 |
Disclosed is a heat-dissipating device for an electronic apparatus. The heat-dissipating device for an electronic apparatus comprises: a thermal base coupled to a first electronic component in such a manner that enables heat-transfer therebetween, so that the heat generated from the first electronic component mounted on a substrate can be absorbed thereby; a first heat-absorption portion that is formed in a capillary shape so that working fluid can be introduced, and coupled with the thermal base in such a manner that enables heat-transfer therebetween; and a heat-pipe loop having a vibrating capillary-shape and provided with a heat-dissipating portion that discharges the heat absorbed from the first heat-absorption portion, wherein the heat-pipe loop has a radially-disposed, empty central area, and an assembly area of a coupling member is exposed in the central area so that the coupling member for coupling the thermal base to the substrate through the central area can be assembled thereon. The heat-dissipating device for an electronic apparatus is stably mounted on the substrate as a result of better structural stability and lighter weight due to light-weight capillary-shaped heat pipe, and enhances assembly performance by securing a pathway in the heat-dissipating device for an electronic apparatus and the assembly area of the substrate, which enables a tool or a user's hand to reach therewithin. |
