SOLID-STATE IMAGE PICKUP DEVICE

摘要

Disclosed is a solid-state image pickup device wherein a translucent substrate can be prevented from breaking at the time of mounting the translucent substrate on a printed wiring board. The solid-state image pickup device is provided with a solid-state image pickup element (5), a transparent glass substrate (1) having the solid-state image pickup element (5) mounted thereon, and a printed wiring board (9) having the transparent glass substrate (1) mounted thereon with a low-melting point solder ball (8) therebetween as a bonding member. The solid-state image pickup element (5) is disposed between the transparent glass substrate (1) and the printed wiring board (9), and an image pickup region (6) is disposed to face the transparent glass substrate (1).