BACKLIGHT MODULE AND LUMINOUS SOURCE ENCAPSULATION STRUCTURE

摘要

A backlight module (10) and light source encapsulation structure (100) comprises a heat dissipating base (120), at least one chip (130) and a heat dissipating fixing member (140). The heat dissipating base (120) comprises a coupling hole (123). The heat dissipating fixing member (140) comprises a coupling pillar (141) and a heat dissipating fin (142) with an abutment surface. The coupling pillar (142) is combined with the coupling hole (123) through a through-hole (201) of a fixing plate (140), in order to make the abutment surface of the dissipating fin (142) abut on the fixing plate (140).